The Development of Baseband and LMP Layers in Bluetooth

The current paper describes an aspect for development of Baseband and LMP layers defined in Bluetooth 1.1 standard specification for implementation purposes. The structure of developed unit consist: control module which manages all other modules in the system, an interface module for interaction with L2Cap and LMP layers, separated modules for data reception and transmition, a module for interface purposes with radio chip, a clock generation module, frequency hopping sequence module, module for implementation of LMP structure. The development of that unit has been done with “top-down” methodology of design. By this way the time for development was generally shorter. Each module of the design was described and developed with hardware description language – VHDL. Using this contemporary method of design allows being mineralized the risk of error in development and easy integration of some components in future works. The design has been orientired for Xilinx’s FPGA XCV600Е-4 platform by test purposes. Also the module has been fully simulated to check its functionality. The final version has been successfully implemented and tested in Xilinx’s FPGA chip.